• Residual stress and interface...
  • *Description*

*Result*: Residual stress and interface debonding behavior in Si3N4w reinforced SiCN composites prepared by the PIP process: A case study

*Title*:
Residual stress and interface debonding behavior in Si3N4w reinforced SiCN composites prepared by the PIP process: A case study / Mingxing Li, Ran Mo, Zeshui Xu, Jie Zhou, Conglin Zhang, Xuefeng Cui, Fang Ye, Laifei Cheng, Ralf Riedel
*Author/editor-in-chief*:
Li, Mingxing (Verfasser); Mo, Ran (Verfasser); Xu, Zeshui (Verfasser); Zhou, Jie (Verfasser); Zhang, Conglin (Verfasser); Cui, Xuefeng (Verfasser); Ye, Fang (Verfasser); Cheng, Laifei (Verfasser); Riedel, Ralf (Verfasser) 
*Published in*:
European Ceramic Society. Journal of the European Ceramic Society. - Amsterdam [u.a.] : Elsevier Science, 1989-. - Online-Ressource. - ISSN 1873-619X. - Band 44, Heft 3 (2024), Seite 1505-1510
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*Publication*:
Amsterdam : Elsevier, 2024
*Format*:
*eArticle*
*Language*:
*eng*
*DOI*:
10.1016/j.jeurceramsoc.2023.09.078
*oa_rights*:
Kein Open Access

*Additional information*

*Additional functions*