*Result*: Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures
Title:
Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures
Authors:
Source:
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-6 Sep, 2025
Relation:
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Database:
IEEE Xplore Digital Library