Treffer: Compensation of externally applied mechanical stress by stacking of ultra-thin chips
Title:
Compensation of externally applied mechanical stress by stacking of ultra-thin chips
Source:
2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2011 Proceedings of the European. :279-282 Sep, 2011
Relation:
ESSDERC 2011 - 41st European Solid State Device Research Conference
Database:
IEEE Xplore Digital Library