WANG, Q., CHEN, X., PARAMANE, A., LI, J., HUANG, X. und REN, N., 2024. Design of Interfacial Electrical Tree-Resistant Packaging Insulation Using Grafted Silicone Elastomer Nanocomposites for High-Temperature Power Modules. IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron. 1 Mai 2024. Vol. 39, no. 5, p. 4933-4946. DOI 10.1109/TPEL.2024.3365304.

Wang, Q., Chen, X., Paramane, A., Li, J., Huang, X., Ren, N., 2024. Design of Interfacial Electrical Tree-Resistant Packaging Insulation Using Grafted Silicone Elastomer Nanocomposites for High-Temperature Power Modules. IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron. 39, 4933-4946. https://doi.org/10.1109/TPEL.2024.3365304

Wang, Q., Chen, X., Paramane, A., Li, J., Huang, X., & Ren, N. (2024). Design of Interfacial Electrical Tree-Resistant Packaging Insulation Using Grafted Silicone Elastomer Nanocomposites for High-Temperature Power Modules. IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions On, IEEE Trans. Power Electron., 39(5), 4933-4946. https://doi.org/10.1109/TPEL.2024.3365304

Wang Q, Chen X, Paramane A, Li J, Huang X, Ren N (2024) Design of Interfacial Electrical Tree-Resistant Packaging Insulation Using Grafted Silicone Elastomer Nanocomposites for High-Temperature Power Modules. IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron. 39:4933-4946. https://doi.org/10.1109/TPEL.2024.3365304

Wang, Q./ Chen, X./ Paramane, A./ Li, J./ Huang, X./ Ren, N., Design of Interfacial Electrical Tree-Resistant Packaging Insulation Using Grafted Silicone Elastomer Nanocomposites for High-Temperature Power Modules, IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron. 2024, 4933-4946.