*Result*: High-Aspect-Ratio, Fine-Pitch Through-Mold Interconnect Fabrication for Heterogeneous Integration of High-Performance Computing Systems
Title:
High-Aspect-Ratio, Fine-Pitch Through-Mold Interconnect Fabrication for Heterogeneous Integration of High-Performance Computing Systems
Authors:
Source:
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-4 Dec, 2025
Relation:
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
Database:
IEEE Xplore Digital Library