• Process Technology Enablers fo...

*Result*: Process Technology Enablers for Aggressive Scaling of Hybrid Bonding Temperature and Pitch

Title:
Process Technology Enablers for Aggressive Scaling of Hybrid Bonding Temperature and Pitch
Authors:
Ma, Kai, Xue, Lei, Bergman, Eric, Bekiaris, Nikolaos, Sekine, Taketo, Hsu, Ching-Hsiang, Rath, Santosh, Ding, Taotao, Weis, Barbara, Probst, Gernot, Uhrmann, Thomas, Wimplinger, Markus
Source:
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :1901-1907 May, 2025
Relation:
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Database:
IEEE Xplore Digital Library