*Result*: Reflow Process Effect on Single Microvias of Different Layers in the Printed Circuit Board

Title:
Reflow Process Effect on Single Microvias of Different Layers in the Printed Circuit Board
Source:
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2025 26th International Conference on. :1-8 Apr, 2025
Relation:
2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Database:
IEEE Xplore Digital Library