• Study on Thermo-Compression Bo...

*Result*: Study on Thermo-Compression Bonding with Non-Conductive Paste Process Technology and Reliability of Flip Chip

Title:
Study on Thermo-Compression Bonding with Non-Conductive Paste Process Technology and Reliability of Flip Chip
Authors:
Lu, Siyuan, Su, Jinyang, Wang, Canwen, Zhu, Wenhui, Wang, Liancheng
Source:
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024
Relation:
2024 25th International Conference on Electronic Packaging Technology (ICEPT)
Database:
IEEE Xplore Digital Library