*Result*: Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

Huo Y; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.; Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China., Song J; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China., Li W; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China., Zhang J; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.; Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China., Zhang Y; Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China., Fu Y; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.; Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China., Yuan W; Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China., Chen X; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China., Liu S; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China., Jiang M; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.; Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China., Cheng Y; Monash Suzhou Research Institute, Monash University, Suzhou, China.; Department of Materials Science and Engineering, Monash University, Clayton, Victoria, Australia., Zhang G; School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.; Yangtze Delta Region Academy in Jiaxing, Beijing Institute of Technology, Jiaxing, China.

Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2026 Feb 16, pp. e24348. Date of Electronic Publication: 2026 Feb 16.

Ahead of Print

Journal Article; Review

English

Publisher: WILEY-VCH Country of Publication: Germany NLM ID: 101664569 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2198-3844 (Electronic) Linking ISSN: 21983844 NLM ISO Abbreviation: Adv Sci (Weinh) Subsets: MEDLINE

Original Publication: Weinheim : WILEY-VCH, [2014]-

M. S. Lundstrom and M. A. Alam, “Moore's Law: The Journey Ahead,” Science 378 (2022): 722–723, https://doi.org/10.1126/science.ade2191.
Y. Wen, C. Chen, Y. Ye, et al., “Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review,” Advanced Materials 34 (2022): 2201023, https://doi.org/10.1002/adma.202201023.
Y.‐M. Ju, T.‐W. Kim, S.‐H. Lee, H.‐J. Lee, J. Ahn, and H.‐S. Kim, “Advanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High‐Performance Die Attach Paste,” Nano Convergence 12 (2025): 38, https://doi.org/10.1186/s40580‐025‐00503‐3.
A.‐C. Iradukunda, D. R. Huitink, and F. Luo, “A Review of Advanced Thermal Management Solutions and the Implications for Integration in High‐Voltage Packages,” IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (2020): 256–271, https://doi.org/10.1109/JESTPE.2019.2953102.
Z. Wang, J. Nan, Z. Tian, P. Liu, Y. Wu, and J. Zhang, “Review on Main Gate Characteristics of P‐Type GaN Gate High‐Electron‐Mobility Transistors,” Micromachines 15 (2024): 80, https://doi.org/10.3390/mi15010080.
H. A. Soomro, M. H. B. M. Khir, S. A. B. M. Zulkifli, G. E. M. Abro, and M. M. Abualnaeem, “Applications of Wide Bandgap Semiconductors in Electric Traction Drives: Current Trends and Future Perspectives,” Results in Engineering 26 (2025): 104679, https://doi.org/10.1016/j.rineng.2025.104679.
A. N. Suthar, J. Venkataramanaiah, and Y. Suresh, “Conventional, Conventional, Wide‐Bandgap, and Hybrid Power Converters: A Comprehensive Review,” Renewable and Sustainable Energy Reviews 213 (2025): 115419, https://doi.org/10.1016/j.rser.2025.115419.
T. Zhan, M. Xu, Z. Cao, et al., “Effects of Thermal Boundary Resistance on Thermal Management of Gallium‐Nitride‐Based Semiconductor Devices: A Review,” Micromachines 14 (2023): 2076, https://doi.org/10.3390/mi14112076.
M. Belmonte, “Advanced Ceramic Materials for High Temperature Applications,” Advanced Engineering Materials 8 (2006): 693–703, https://doi.org/10.1002/adem.200500269.
A. Almansoori, K. Balázsi, and C. Balázsi, “Advances, Challenges, and Applications of Graphene and Carbon Nanotube‐Reinforced Engineering Ceramics,” Nanomaterials 14 (2024): 1881, https://doi.org/10.3390/nano14231881.
Q. Shen, Z. Lin, J. Deng, et al., “Effects of β‐Si3N4 Seeds on Microstructure and Performance of Si3N4 Ceramics in Semiconductor Package,” Materials 16 (2023): 4461, https://doi.org/10.3390/ma16124461.
H. Xiong, B. Li, X. Xi, and Q. Shan, “Preparation of graded silicon nitride ceramics with high mechanical performance using β‐Si3N4 seeds,” Ceramics International 49 (2023): 36528–36535, https://doi.org/10.1016/j.ceramint.2023.08.336.
Y. Liu, R. Liu, Z. Tong, et al., “Optimization of Microstructure to Improve Si3N4 Ceramics with Thermal Conductivity and Mechanical Properties: Effect of Si and α‐Si3N4 Powder Composition,” Journal of Alloys and Compounds 1010 (2025): 177831, https://doi.org/10.1016/j.jallcom.2024.177831.
J. Wu, G. Yuan, Z. Jiao, et al., “Optimizing Interface Microstructure of Diamond Reinforced Al Matrix Composites via Nano‐Scale Si‐Al Coatings towards Enhanced Thermophysical Performance,” Applied Surface Science 693 (2025): 162786, https://doi.org/10.1016/j.apsusc.2025.162786.
P. Zhu, P. Wang, P. Shao, et al., “Research Progress in Interface Modification and Thermal Conduction Behavior of Diamond/Metal Composites,” International Journal of Minerals, Metallurgy and Materials 29 (2022): 200–211, https://doi.org/10.1007/s12613‐021‐2339‐6.
Y. Zhang, L. Wang, J. Hao, N. Li, X. Wang, and H. Zhang, “Effect of Diamond Particle Size on Thermal Conductivity and Thermal Stability of Zr‐Diamond/Cu Composite,” Diamond and Related Materials 146 (2024): 111257, https://doi.org/10.1016/j.diamond.2024.111257.
A. Sukserm, M. Ceppatelli, M. Serrano‐Ruiz, et al., “Stability, Chemical Bonding, and Electron Lone Pair Localization in AsN at High Pressure by Density Functional Theory Calculations,” Inorganic Chemistry 63 (2024): 8142–8154, https://doi.org/10.1021/acs.inorgchem.4c00342.
L. Wei, L. Ma, Q. Qi, et al., “Ordered Alignment of 2D Heterogeneous Filler for Enhancing Anisotropic Thermal Conduction Capability of Multifunctional Composite,” Carbon 243 (2025): 120625, https://doi.org/10.1016/j.carbon.2025.120625.
C. Du, G. Zou, J. Huo, B. Feng, Z. A, and L. Liu, “Generative AI‐Enabled Microstructure Design of Porous Thermal Interface Materials with Desired Effective Thermal Conductivity,” Journal of Materials Science 58 (2023): 16160–16171, https://doi.org/10.1007/s10853‐023‐09018‐w.
D. Wu, Z. Xu, and D. Guo, “Machine Learning Accelerates Programmable Mechanics in Isotropic Diamond Plate Lattices,” International Journal of Mechanical Sciences 302 (2025): 110595, https://doi.org/10.1016/j.ijmecsci.2025.110595.
N. Dimitriou, L. Leontaris, T. Vafeiadis, et al., “Fault Diagnosis in Microelectronics Attachment via Deep Learning Analysis of 3‐D Laser Scans,” IEEE Transactions on Industrial Electronics 67 (2020): 5748–5757, https://doi.org/10.1109/TIE.2019.2931220.
A. L. Moore and L. Shi, “Emerging Challenges and Materials for Thermal Management of Electronics,” Materials Today 17 (2014): 163–174, https://doi.org/10.1016/j.mattod.2014.04.003.
C. Zhang, L. Sun, B. Huang, X. Yang, Y. Chu, and B. Zhan, “Electrical and Mechanical Properties of CNT/CB Dual Filler Conductive Adhesives (DFCAs) for Automotive Multi‐Material Joints,” Composite Structures 225 (2019): 111183, https://doi.org/10.1016/j.compstruct.2019.111183.
N. Vasilakis, D. Moschou, D. Carta, H. Morgan, and T. Prodromakis, “Long‐Long‐Lasting FR‐4 Surface Hydrophilisation towards Commercial PCB Passive Microfluidics,” Applied Surface Science 368 (2016): 69–75, https://doi.org/10.1016/j.apsusc.2015.12.123.
X. Liu, W. Chen, X. Feng, et al., “Synergistic Enhancement of Thermal Stability and Dielectric Performance of BT Resin Composites via Difunctional Phthalonitrile Monomers for High‐Frequency PCB Substrates,” Composites Part B: Engineering 309 (2026): 113042, https://doi.org/10.1016/j.compositesb.2025.113042.
P.‐C. Hsu, S.‐C. Chang, W.‐X. Lu, H.‐C. Liu, and C.‐E. Ho, “Enhanced Adhesion Strength Between Electroplated Cu and ABF Substrate with Isothermal Annealing Treatment,” Surface and Coatings Technology 479 (2024): 130576, https://doi.org/10.1016/j.surfcoat.2024.130576.
F. Hu, Z.‐P. Xie, J. Zhang, Z.‐L. Hu, and D. An, “Promising High‐Thermal‐Conductivity Substrate Material for High‐Power Electronic Device: Silicon Nitride Ceramics,” Rare Metals 39 (2020): 463–478, https://doi.org/10.1007/s12598‐020‐01376‐7.
J. Hostaša, W. Pabst, and J. Matějíček, “Thermal Conductivity of Al2O3–ZrO2 Composite Ceramics,” Journal of the American Ceramic Society 94 (2011): 4404–4409, https://doi.org/10.1111/j.1551‐2916.2011.04875.x.
R. Khazaka, L. Mendizabal, and D. Henry, “Review on Joint Shear Strength of Nano‐Silver Pasteand Its Long‐Term High Temperature Reliability,” Journal of Electronic Materials 43 (2014): 2459–2466, https://doi.org/10.1007/s11664‐014‐3202‐6.
M. Kutz, Handbook of Materials Selection (John Wiley & Sons, 2002), https://doi.org/10.1002/9780470172551.
J. R. Davis, Aluminum and Aluminum Alloys (ASM International, 1993).
N. Burger, A. Laachachi, M. Ferriol, M. Lutz, V. Toniazzo, and D. Ruch, “Review of Thermal Conductivity in Composites: Mechanisms, Parameters and Theory,” Progress in Polymer Science 61 (2016): 1–28, https://doi.org/10.1016/j.progpolymsci.2016.05.001.
J. Freudenberger and H. Warlimont, “Copper and Copper Alloys,” in Springer Handbook of Materials Data, ed. H. Warlimont and W. Martienssen (Springer International Publishing: Cham, 2018), https://doi.org/10.1007/978‐3‐319‐69743‐7_12.
A. Zhang and Y. Li, “Thermal Conductivity of Aluminum Alloys—A Review,” Materials 16 (2023): 2972, https://doi.org/10.3390/ma16082972.
W. M. Haynes ed., CRC Handbook of Chemistry and Physics, 97th ed. (CRC Press, 2016), https://doi.org/10.1201/9781315380476.
M. McQUARRIE, “Thermal Conductivity: VII, Analysis of Variation of Conductivity with Temperature for Al2O3, BeO, and MgO,” Journal of the American Ceramic Society 37 (1954): 91–95, https://doi.org/10.1111/j.1551‐2916.1954.tb20106.x.
W. Werdecker and F. Aldinger, “Aluminum Nitride‐An Alternative Ceramic Substrate for High Power Applications in Microcircuits,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology 7 (1984): 399–404, https://doi.org/10.1109/TCHMT.1984.1136380.
X. Zhou, J. Zhang, M. Hou, et al., “Study on the Mechanical Properties at High Temperatures and Relevant Mechanism of Beryllium Oxide Ceramics,” Journal of Nuclear Materials 611 (2025): 155813, https://doi.org/10.1016/j.jnucmat.2025.155813.
W. T. Shoulders, M. Guziewski, and J. J. Swab, “Microstructural and Thermal Stress Effects on Mechanical Properties of Boron Carbide Particle‐Reinforced Silicon Carbide,” Journal of the American Ceramic Society 107 (2024): 1249–1261, https://doi.org/10.1111/jace.19535.
W. Liu, Y. Shen, D. Li, X. Ouyang, Q. Liu, and S. Wang, “Preparation of 99.6% Alumina Ceramic Substrates with High Thermal Conductivity by Tape Casting and Warm Pressing Process,” Ceramics International 51 (2025): 5000–5010, https://doi.org/10.1016/j.ceramint.2024.11.471.
S. Fu, Z. Jia, W. Ding, Y. Bao, and D. Wan, “Synthesis and Characterization of a High‐Strength Alumina Ceramic Reinforced by AlN‐Al2O3 Coating,” Journal of Materials Science 59 (2024): 14235–14244, https://doi.org/10.1007/s10853‐024‐10048‐1.
D. Liu, J. Hu, G. Zhang, et al., “Effect of Synthesizing Temperature of Alumina Powder with Rose‐Like Structure on the Microstructure and Mechanical Property of Alumina Ceramic,” Journal of Materials Research and Technology 28 (2024): 1907–1914, https://doi.org/10.1016/j.jmrt.2023.12.104.
R. K. Ulrich and W. D. Brown, Advanced Electronic Packaging (John Wiley & Sons, 2006), https://doi.org/10.1109/9780471754503.
A. M. Abyzov, “Aluminum Oxide and Alumina Ceramics (Review). Part 1. Properties of Al2O3 and Commercial Production of Dispersed Al2O3,” Refractories and Industrial Ceramics 60 (2019): 24–32, https://doi.org/10.1007/s11148‐019‐00304‐2.
J. Du, B. Tang, W. Liu, et al., “Effects of Annealing and Firing in Wet Hydrogen on the Dielectric Breakdown Strengths of Alumina Ceramics,” Journal of Advanced Ceramics 9 (2020): 173–182, https://doi.org/10.1007/s40145‐019‐0357‐x.
K. Lin, X. Zong, P. Sheng, et al., “Effects of SmF3 Addition on Aluminum Nitride Ceramics via Pressureless Sintering,” Journal of the European Ceramic Society 43 (2023): 6804–6814, https://doi.org/10.1016/j.jeurceramsoc.2023.07.051.
Z. Zhang, H. Wu, S. Zhang, et al., “The Quantitative Investigation of the Lattice Oxygen and Grain Edge Oxygen on the Thermal Conductivity of Aluminum Nitride Ceramics,” Journal of the European Ceramic Society 43 (2023): 313–320, https://doi.org/10.1016/j.jeurceramsoc.2022.10.023.
G. Yin, T. Zhao, X. Chen, et al., “Enhancing Thermal Conductivity of Aluminum Nitride Ceramics Through Control of Oxygen Impurities and Heavy Rare Earth Doping: A First‐Principles and Experimental Study,” Ceramics International 51 (2025): 26225–26233, https://doi.org/10.1016/j.ceramint.2025.03.305.
H. Jiang, X.‐H. Wang, G.‐F. Fan, et al., “Effect of Oxidation on Flexural Strength and Thermal Properties of AlN Ceramics with Residual Stress and Impedance Spectroscopy Analysis of Defects and Impurities,” Ceramics International 45 (2019): 13019–13023, https://doi.org/10.1016/j.ceramint.2019.03.232.
K. Lin, G. Nie, P. Sheng, S. Zhao, and S. Wu, “Effects of Doping Al‐Metal Powder on Thermal, Mechanical and Dielectric Properties of AlN Ceramics,” Ceramics International 48 (2022): 36210–36217, https://doi.org/10.1016/j.ceramint.2022.08.178.
S.‐F. Wang, K.‐K. Chao, Y.‐L. Liao, H.‐H. Hsu, and E. Y. Chang, “Relations Among Composition, Microstructure, and Mechanical and Dielectric Properties From 1 MHz to 100 GHz of Aluminum Nitride Substrates,” Journal of Alloys and Compounds 1005 (2024): 176147, https://doi.org/10.1016/j.jallcom.2024.176147.
Y. Duan, J. Zhang, X. Li, Y. Shi, J. Xie, and D. Jiang, “Low Temperature Pressureless Sintering of Silicon Nitride Ceramics for Circuit Substrates in Powder Electronic Devices,” Ceramics International 44 (2018): 4375–4380, https://doi.org/10.1016/j.ceramint.2017.12.033.
Y. Nakashima, Y. Zhou, K. Hirao, T. Ohji, and M. Fukushima, “Effects of Sintering Temperature and Holding Time on Sintering Behavior, Mechanical Properties and Thermal Conductivity of Silicon Nitride Ceramics,” Ceramics International 51 (2025): 26757–26763, https://doi.org/10.1016/j.ceramint.2025.03.356.
Y. Zhou, H. Hyuga, Y. Nakashima, K. Hirao, T. Ohji, and M. Fukushima, “Effects of Rare‐Earth Oxides on Microstructure, Thermal Conductivity, and Mechanical Properties of Silicon Nitride,” Journal of the American Ceramic Society 108 (2025): 70028, https://doi.org/10.1111/jace.70028.
Y. Zhuang, F. Sun, L. Zhou, et al., “The Influence of Magnesium Compounds on the Properties of Silicon Nitride Ceramics,” International Journal of Applied Ceramic Technology 21 (2024): 2273–2287, https://doi.org/10.1111/ijac.14665.
F. Hu, T. Zhu, Z. Xie, and J. Liu, “Effect of Composite Sintering Additives Containing Non‐Oxide on Mechanical, Thermal and Dielectric Properties of Silicon Nitride Ceramics Substrate,” Ceramics International 47 (2021): 13635–13643, https://doi.org/10.1016/j.ceramint.2021.01.224.
Y. Nakashima, Y. Zhou, K. Tanabe, et al., “Effect of Microstructures on Dielectric Breakdown Strength of Sintered Reaction‐Bonded Silicon Nitride Ceramics,” Journal of the American Ceramic Society 106 (2023): 1139–1148, https://doi.org/10.1111/jace.18826.
V. P. Adiga, R. De Alba, I. R. Storch, P. A. Yu, B. Ilic, et al., “Simultaneous Electrical and Optical Readout of Graphene‐Coated High Q Silicon Nitride Resonators,” Applied Physics Letters 103 (2013): 143103, https://doi.org/10.1063/1.4823457.
H. Imamura, T. Kawata, S. Honda, and Y. Iwamoto, “Correction to: A Facile Method to Produce Rod‐Like β‐Si3N4 Seed Crystallites for Bimodal Structure Controlling,” Journal of the American Ceramic Society 106 (2023): 5102, https://doi.org/10.1111/jace.19114.
B. Palanki, “Some Factors Affecting Densification and Grain Growth in the Sintering of Uranium Dioxide—A Brief Review,” Journal of Nuclear Materials 550 (2021): 152918, https://doi.org/10.1016/j.jnucmat.2021.152918.
M. Kitayama, K. Hirao, A. Tsuge, K. Watari, M. Toriyama, and S. Kanzaki, “Thermal Conductivity of β‐Si3N4: II, Effect of Lattice Oxygen,” Journal of the American Ceramic Society 83 (2000): 1985–1992, https://doi.org/10.1111/j.1151‐2916.2000.tb01501.x.
Z. Lei, Y. Ding, X. Ju, Q. Wang, Y. Peng, and M. Chen, “Integrated Cold Sintering of Ceramic Circuit Substrate for Power Device Packaging,” Ceramics International 51 (2025): 17870–17878, https://doi.org/10.1016/j.ceramint.2025.01.557.
M. Choe, S. H. Ryu, J. Jeon, et al., “Stabilization of Top‐Gate p‐SnO Transistors via Ultrathin Al2O3 Interlayers for Hysteresis‐Free Operation,” Journal of Materials Chemistry C 13 (2025): 12308–12316, https://doi.org/10.1039/D5TC00399G.
S. Li, S. Chen, G. Tan, et al., “High‐Strength High‐Thermal‐Conductivity Al2O3 Ceramics via Colloidal Processing and Low‐Temperature Pressureless Sintering,” Journal of the American Ceramic Society 108 (2025): 20552, https://doi.org/10.1111/jace.20552.
Y. Xiong, Z. Fu, Y. Wang, and F. Quan, “Fabrication of Transparent AlN Ceramics,” Journal of Materials Science 41 (2006): 2537–2539, https://doi.org/10.1007/s10853‐006‐5314‐8.
K. Watari, K. Ishizaki, and T. Fujikawa, “Thermal Conduction Mechanism of Aluminium Nitride Ceramics,” Journal of Materials Science 27 (1992): 2627–2630, https://doi.org/10.1007/BF00540680.
F. Yang, Y. Chen, W. Hai, et al., “Research Progress on High‐Thermal‐Conductivity Silicon Carbide Ceramics,” Ceramics International 51 (2025): 4095–4109, https://doi.org/10.1016/j.ceramint.2024.11.408.
H. Tao, X. Qin, J. Sui, et al., “Textured Silicon Nitride Ceramics with Enhanced Properties Fabricated by High Pressure Sintering,” Ceramics International 51 (2025): 33324–33331, https://doi.org/10.1016/j.ceramint.2025.05.065.
J. S. Haggerty and A. Lightfoot, “Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics through Improved Processing,” in Proceedings of the 19th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures—A: Ceramic Engineering and Science Proceedings, Ltd, (John Wiley & Sons, 1995), https://doi.org/10.1002/9780470314715.ch52.
Y. Zhou, H. Hyuga, D. Kusano, Y. Yoshizawa, and K. Hirao, “A Tough Silicon Nitride Ceramic with High Thermal Conductivity,” Advanced Materials 23 (2011): 4563–4567, https://doi.org/10.1002/adma.201102462.
Y. Fukuda, K. Harada, M. Yonetsu, et al., “Relation Between Crystal Structure and Lattice Oxygen Content of Sintered Reaction‐Bonded Silicon Nitride,” Journal of the American Ceramic Society 104 (2021): 6563–6571, https://doi.org/10.1111/jace.18023.
K. Hirao, Y. Zhou, H. Hyuga, T. Ohji, and D. Kusano, “High Thermal Conductivity Silicon Nitride Ceramics,” Journal of the Korean Ceramic Society 49 (2012): 380–384, https://doi.org/10.4191/kcers.2012.49.4.380.
H. Yokota, H. Abe, and M. Ibukiyama, “Effect of Lattice Defects on the Thermal Conductivity of β‐Si3N4,” Journal of the European Ceramic Society 23 (2003): 1751–1759, https://doi.org/10.1016/S0955‐2219(02)00374‐6.
A. Kuwabara, K. Matsunaga, and I. Tanaka, “Lattice Dynamics and Thermodynamical Properties of Silicon Nitride Polymorphs,” Physical Review B 78 (2008): 064104, https://doi.org/10.1103/PhysRevB.78.064104.
J.‐S. Lee, J.‐H. Mun, B.‐D. Han, and H.‐D. Kim, “Effect of β‐Si3N4 Seed Particles on the Property of Sintered Reaction‐Bonded Silicon Nitride,” Ceramics International 29 (2003): 897–905, https://doi.org/10.1016/S0272‐8842(03)00034‐8.
H. Ding, Y. Hu, X. Li, Z. Zhao, and H. Ji, “Microstructure, Mechanical Properties and Sintering Mechanism of Pressureless‐Sintered Porous Si3N4 Ceramics with YbF3‐MgF2 Composite Sintering Aids,” Ceramics International 46 (2020): 2558–2564, https://doi.org/10.1016/j.ceramint.2019.09.114.
Y. Nakashima, R. Furushima, Y. Zhou, K. Hirao, T. Ohji, and M. Fukushima, “Deciphering the Effect of Grain Boundary Characteristics on Fracture Toughness of Silicon Nitride Ceramics Through a CNN Regression Model,” Ceramics International 50 (2024): 6680–6686, https://doi.org/10.1016/j.ceramint.2023.12.006.
X. W. Zhu, Y. Sakka, T. S. Suzuki, T. Uchikoshi, and S. Kikkawa, “The c‐Axis Texturing of Seeded Si3N4 with β‐Si3N4 Whiskers by Slip Casting in a Rotating Magnetic Field,” Acta Materialia 58 (2010): 146–161, https://doi.org/10.1016/j.actamat.2009.08.064.
W. Wang, D. Yao, H. Liang, et al., “Enhanced Thermal Conductivity in Si3N4 Ceramics Prepared by Using ZrH2 as an Oxygen Getter,” Journal of Alloys and Compounds 855 (2021): 157451, https://doi.org/10.1016/j.jallcom.2020.157451.
H. Xie, P. Liu, H. Liang, et al., “A Cost‐Effective Strategy for Fabricating High Thermal Conductivity Si3N4 Ceramics with Well‐Balanced Properties,” Journal of the European Ceramic Society 46 (2026): 117937, https://doi.org/10.1016/j.jeurceramsoc.2025.117937.
B. Fan, T. Wang, D. Zhao, et al., “Tailored Grain Growth Strategy for Si3N4 Ceramics With Enhanced Thermal and Mechanical Performance,” Journal of Alloys and Compounds 1048 (2025): 185175, https://doi.org/10.1016/j.jallcom.2025.185175.
X. Chen, Y. Li, Y. Qi, et al., “Preparation of Si3N4 Ceramics with High Thermal Conductivity and Mechanical Properties Using Novel Gd3Si2C2 as a Sintering Aid,” Ceramics International 51 (2025): 9931–9938, https://doi.org/10.1016/j.ceramint.2024.12.425.
Y. Liu, R. Liu, Y. Zheng, et al., “Densification, Microstructure, Thermal and Mechanical Properties of Si3N4 Ceramics: Effect of Y2Si4N6C and MgSiN2 Content,” Ceramics International 50 (2024): 38507–38513, https://doi.org/10.1016/j.ceramint.2024.07.215.
Y. Liu, R. Liu, Y. Zheng, et al., “Effect of the Ratio of Y2O3 and MgSiN2 Sintering Additives on the Microstructure, Thermal and Mechanical Properties of Si3N4 Ceramics,” Ceramics International 49 (2023): 36490–36496, https://doi.org/10.1016/j.ceramint.2023.08.332.
S. Fu, Z. Yang, H. Li, L. Wang, Y. Li, and J. Li, “Effects of Gd2O3 and MgSiN2 Sintering Additives on the Thermal Conductivity and Mechanical Properties of Si3N4 Ceramics,” International Journal of Applied Ceramic Technology 20 (2023): 1855–1864, https://doi.org/10.1111/ijac.14279.
M. Huang, Y. Huang, J. Ou, Y. Wu, J. Wang, and S. Wu, “Effect of a New Nonoxide Additive, Y3Si2C2, on the Thermal Conductivity and Mechanical Properties of Si3N4 Ceramics,” International Journal of Applied Ceramic Technology 19 (2022): 3403–3409, https://doi.org/10.1111/ijac.14132.
W. Wang, D. Yao, H. Liang, et al., “Improved Thermal Conductivity of β‐Si3N4 Ceramics Through the Modification of the Liquid Phase by Using GdH2 as a Sintering Additive,” Ceramics International 47 (2021): 5631–5638, https://doi.org/10.1016/j.ceramint.2020.10.148.
W. Wang, D. Yao, H. Chen, et al., “ZrSi2–MgO as Novel Additives for High Thermal Conductivity of β‐Si3N4 Ceramics,” Journal of the American Ceramic Society 103 (2020): 2090–2100, https://doi.org/10.1111/jace.16902.
K. Shimada and J. Tatami, “Effect of Coarse‐Si‐Powder Addition on the Thermal and Mechanical Properties of Sintered Reaction‐Bonded Silicon Nitride,” Ceramics International 51 (2025): 44942–44951, https://doi.org/10.1016/j.ceramint.2025.07.215.
Y. Nakashima, Y. Zhou, K. Tanabe, et al., “Effects of Nitridation Temperature on Properties of Sintered Reaction‐Bonded Silicon Nitride,” International Journal of Applied Ceramic Technology 20 (2023): 1071–1080, https://doi.org/10.1111/ijac.14163.
H.‐M. Oh and H.‐K. Lee, “Controlling the Width of Particle Size Distribution of Si Powder and Properties of Sintered Reaction‐Bonded Silicon Nitride (SRBSN) Ceramics with High Thermal Conductivity,” Ceramics International 46 (2020): 12517–12524, https://doi.org/10.1016/j.ceramint.2020.02.014.
Y. Zhou, X. Zhu, K. Hirao, and Z. Lences, “Sintered Reaction‐Bonded Silicon Nitride with High Thermal Conductivity and High Strength,” International Journal of Applied Ceramic Technology 5 (2008): 119–126, https://doi.org/10.1111/j.1744‐7402.2008.02187.x.
X. Zhu, Y. Sakka, Y. Zhou, and K. Hirao, “Processing and Properties of Sintered Reaction‐Bonded Silicon Nitride with Y2O3–MgSiN2: Effects of Si Powder and Li2O Addition,” Acta Materialia 55 (2007): 5581–5591, https://doi.org/10.1016/j.actamat.2007.06.014.
F. Hu, Z. Wang, and Z. Xie, “Enhancing Si3N4 Ceramic Performance by Microstructure Control through Sintering Additive Optimization and Grain Orientation Control,” Ceramics International 51 (2025): 53442–53450, https://doi.org/10.1016/j.ceramint.2025.09.092.
H. Liang, W. Wang, K. Zuo, et al., “Effect of LaB6 Addition on Mechanical Properties and Thermal Conductivity of Silicon Nitride Ceramics,” Ceramics International 46 (2020): 17776–17783, https://doi.org/10.1016/j.ceramint.2020.04.083.
H. Liang, W. Wang, K. Zuo, et al., “YB2C2: A New Additive for Fabricating Si3N4 Ceramics with Superior Mechanical Properties and Medium Thermal Conductivity,” Ceramics International 46 (2020): 5239–5243, https://doi.org/10.1016/j.ceramint.2019.10.272.
H. Liang, Y. Zeng, K. Zuo, Y. Xia, D. Yao, and J. Yin, “Mechanical Properties and Thermal Conductivity of Si3N4 Ceramics with YF3 and MgO as Sintering Additives,” Ceramics International 42 (2016): 15679–15686, https://doi.org/10.1016/j.ceramint.2016.07.024.
C. Yang, Q. Liu, B. Zhang, et al., “Effect of MgF2 Addition on Mechanical Properties and Thermal Conductivity of Silicon Nitride Ceramics,” Ceramics International 45 (2019): 12757–12763, https://doi.org/10.1016/j.ceramint.2019.03.183.
X. Lv, J. Huang, X. Dong, Q. Yan, and C. Ge, “Influence of α‐Si3N4 Coarse Powder on Densification, Microstructure, Mechanical Properties, and Thermal Behavior of Silicon Nitride Ceramics,” Ceramics International 49 (2023): 21815–21824, https://doi.org/10.1016/j.ceramint.2023.04.003.
Z. Guo, Q. Qin, J. Huang, et al., “Effect of Non‐Oxide Additives on the Phase Composition, Microstructure, Mechanical Properties and Thermal Conductivity of Si3N4 Fabricated by Spark Plasma Sintering and Annealing,” Ceramics International 51 (2025): 57790–57799, https://doi.org/10.1016/j.ceramint.2025.09.479.
Y. Duan, J. Zhang, X. Li, H. Bai, P. Sajgalik, and D. Jiang, “High Thermal Conductivity Silicon Nitride Ceramics Prepared by Pressureless Sintering with Ternary Sintering Additives,” International Journal of Applied Ceramic Technology 16 (2019): 1399–1406, https://doi.org/10.1111/ijac.13220.
C. Luo, Y. Zhang, and T. Deng, “Pressureless Sintering of High Performance Silicon Nitride Ceramics at 1620°C,” Ceramics International 47 (2021): 29371–29378, https://doi.org/10.1016/j.ceramint.2021.07.104.
D. Kusano, S. Adachi, G. Tanabe, H. Hyuga, Y. Zhou, and K. Hirao, “Effects of Impurity Oxygen Content in Raw Si Powder on Thermal and Mechanical Properties of Sintered Reaction‐Bonded Silicon Nitrides,” International Journal of Applied Ceramic Technology 9 (2012): 229–238, https://doi.org/10.1111/j.1744‐7402.2011.02618.x.
P. D. Ramesh, R. Oberacker, and M. J. Hoffmann, “Preparation of β‐Silicon Nitride Seeds for Self‐Reinforced Silicon Nitride Ceramics,” Journal of the American Ceramic Society 82 (1999): 1608–1610, https://doi.org/10.1111/j.1151‐2916.1999.tb01969.x.
H.‐H. Lu and J.‐L. Huang, “Microstructure in Silicon Nitride Containing β‐Phase Seeding: Part I,” Journal of Materials Research 14 (1999): 2966–2973, https://doi.org/10.1557/JMR.1999.0397.
P. Dehghani, S. S. S. Afghahi, F. Soleimani, P. Dehghani, S. S. S. Afghahi, and F. Soleimani, “Hot Isostatic Pressing (HIP) in Advanced Ceramics Production,” in Advanced Ceramic Materials—Emerging Technologies (IntechOpen, 2025), https://doi.org/10.5772/intechopen.1007176.
L. Cao, Z. Wang, Z. Yin, K. Liu, and J. Yuan, “Investigation on Mechanical Properties and Microstructure of Silicon Nitride Ceramics Fabricated by Spark Plasma Sintering,” Materials Science and Engineering: A 731 (2018): 595–602, https://doi.org/10.1016/j.msea.2018.06.093.
H. Miyazaki, Y. Zhou, S. Iwakiri, et al., “Improved Resistance to Thermal Fatigue of Active Metal Brazing Substrates for Silicon Carbide Power Modules Using Tough Silicon Nitrides with High Thermal Conductivity,” Ceramics International 44 (2018): 8870–8876, https://doi.org/10.1016/j.ceramint.2018.02.072.
J. Li, Q. Jiang, Z. Pan, D. Lv, and S. Wu, “Fabrication of Silicon Nitride with High Thermal Conductivity and Flexural Strength by Hot‐Pressing Flowing Sintering,” International Journal of Applied Ceramic Technology 21 (2024): 2841–2849, https://doi.org/10.1111/ijac.14741.
X. Zhu, S. Y. W, Y. Zhou, K. Hirao, and K. Itatani, “A Strategy for Fabricating Textured Silicon Nitride with Enhanced Thermal Conductivity,” Journal of the European Ceramic Society 34 (2014): 2585–2589, https://doi.org/10.1016/j.jeurceramsoc.2014.01.025.
X. Zhu and Y. Sakka, “Textured Silicon Nitride: Processing and Anisotropic Properties,” Science and Technology of Advanced Materials 9 (2008): 033001, https://doi.org/10.1088/1468‐6996/9/3/033001.
Y.‐P. Zeng, J.‐F. Yang, N. Kondo, T. Ohji, H. Kita, and S. Kanzaki, “Fracture Energies of Tape‐Cast Silicon Nitride with β‐Si3N4 Seed Addition,” Journal of the American Ceramic Society 88 (2005): 1622–1624, https://doi.org/10.1111/j.1551‐2916.2005.00242.x.
S.‐J. Tang, Z.‐H. Li, W.‐M. Guo, J.‐J. Yu, S.‐K. Sun, and H.‐T. Lin, “Fabrication of One‐Dimensional Textured Si3N4‐Based Ceramics with High Hardness and Toughness by Low Temperature Hot Extrusion,” Ceramics International 50 (2024): 41975–41981, https://doi.org/10.1016/j.ceramint.2024.08.022.
Z.‐H. Li, S.‐Y. Tong, Y.‐X. Wang, J.‐J. Yu, W.‐M. Guo, and H.‐T. Lin, “Si3N4 Ceramics with Fine‐Grained Bimodal Microstructure and Excellent Mechanical Properties Prepared by Two‐Step Spark Plasma Sintering,” Journal of the European Ceramic Society 45 (2025): 117331, https://doi.org/10.1016/j.jeurceramsoc.2025.117331.
R. Geng, T. Fan, P. Yang, et al., “High‐Performance Si3N4 Ceramics Prepared by Gas Pressure Sintering with Y2O3‐MgO‐MgSiN2 Ternary Additives,” Ceramics International 51 (2025): 43978–43985, https://doi.org/10.1016/j.ceramint.2025.07.128.
P. Aiyi, L. Junguo, C. Yang, L. Meijuan, and S. Qiang, “Low‐Temperature Fabrication of Si3N4 Ceramics with High Thermal Conductivities using a Single Mg2Si Sintering Additive,” Ceramics International 49 (2023): 39473–39478, https://doi.org/10.1016/j.ceramint.2023.09.293.
S. Liao, Y. Zhuang, J. Wang, et al., “Synergistic Effect of Binary Fluoride Sintering Additives on the Properties of Silicon Nitride Ceramics,” Ceramics International 48 (2022): 21832–21845, https://doi.org/10.1016/j.ceramint.2022.04.167.
Y. Shi, Q. He, A. Wang, H. Wang, W. Wang, and Z. Fu, “New Perspective on the Texture Evolution Mechanism of Si3N4 Ceramics: Effect of Additive Content,” Ceramics International 49 (2023): 22602–22607, https://doi.org/10.1016/j.ceramint.2023.01.136.
K. Shimada and J. Tatami, “Grain and Grain Boundary Strength of Silicon Nitride Ceramics with Different Thermal Conductivities and Microstructures,” Ceramics International 51 (2025): 24306–24313, https://doi.org/10.1016/j.ceramint.2025.03.119.
W. Wang, Y. Liu, Y. Pan, et al., “The Effects of Silicon Additive Content on Thermal Conductivity and Mechanical Properties of Si3N4 Ceramics,” Journal of the American Ceramic Society 108 (2025): 20534, https://doi.org/10.1111/jace.20534.
Q. Zhang, W. Wang, Z. Zhang, et al., “Enhancing Fracture Toughness of Silicon Nitride Ceramics by Addition of β‐Si3N4 Whisker and MXene,” Ceramics International 50 (2024): 35695–35705, https://doi.org/10.1016/j.ceramint.2024.06.387.
H. Xiong, B. Li, X. Xi, and Q. Shan, “Preparation of Graded Silicon Nitride Ceramics with High Mechanical Performance Using β‐Si3N4 Seeds,” Ceramics International 49 (2023): 36528–36535, https://doi.org/10.1016/j.ceramint.2023.08.336.
J. Zhang, G. Liu, W. Cui, et al., “Plastic Deformation in Silicon Nitride Ceramics via Bond Switching at Coherent Interfaces,” Science 378 (2022): 371–376, https://doi.org/10.1126/science.abq7490.
R. Furushima, Y. Nakashima, Y. Zhou, K. Hirao, T. Ohji, and M. Fukushima, “Thermal Conductivity Prediction of Sintered Reaction Bonded Silicon Nitride Ceramics Using a Machine Learning Approach Based on Process Conditions,” Ceramics International 50 (2024): 8520–8526, https://doi.org/10.1016/j.ceramint.2023.12.231.
R. Furushima, Y. Nakashima, Y. Zhou, K. Hirao, T. Ohji, and M. Fukushima, “Multilayer Artificial Intelligence for Thermal‐Conductivity Prediction of Silicon Nitride Ceramics From Powder Processing Conditions and Predicted Densities,” Ceramics International 50 (2024): 24008–24015, https://doi.org/10.1016/j.ceramint.2024.04.132.
R. Furushima, Y. Nakashima, Y. Maruyama, K. Hirao, T. Ohji, and M. Fukushima, “Artificial Intelligence‐Based Determination of Fracture Toughness and Bending Strength of Silicon Nitride Ceramics,” Journal of the American Ceramic Society 106 (2023): 4944–4954, https://doi.org/10.1111/jace.19147.
D. Milardovich, C. Wilhelmer, D. Waldhoer, L. Cvitkovich, G. Sivaraman, and T. Grasser, “Machine Learning Interatomic Potential for Silicon‐Nitride (Si3N4) by Active Learning,” Journal of Chemical Physics 158 (2023): 194802, https://doi.org/10.1063/5.0146753.
W. Guo, F. Wang, Z. Zhang, Z. Liu, W. Zhang, and S. Bai, “Accelerated Design of High Thermal Conductivity Si3N4 Ceramics Based on Machine Learning,” Ceramics International 51 (2025): 33145–33154, https://doi.org/10.1016/j.ceramint.2025.05.047.
A. Wang, W. Xiong, J. Zhou, K. Qu, and H. He, “A New Path to Intelligent Quantitative Prediction of Ceramic Strength: Machine Vision Combined with Machine Learning,” Journal of the American Ceramic Society 108 (2025): 70025, https://doi.org/10.1111/jace.70025.
A. Sharma, T. Mukhopadhyay, S. M. Rangappa, S. Siengchin, and V. Kushvaha, “Advances in Computational Intelligence of Polymer Composite Materials: Machine Learning Assisted Modeling, Analysis and Design,” Archives of Computational Methods in Engineering (2022): 3341–3385, https://doi.org/10.1007/s11831‐021‐09700‐9.
R. Furushima, Y. Nakashima, Y. Maruyama, et al., “Microstructural Basis of AI Predictions for Material Properties: A Case Study of Silicon Nitride Ceramics Using t‐SNE,” Journal of the American Ceramic Society 108 (2025): 20173, https://doi.org/10.1111/jace.20173.
C. C. Price, Y. Li, G. Zhou, et al., “Predicting and Accelerating Nanomaterial Synthesis Using Machine Learning Featurization,” Nano Letters 24 (2024): 14862–14867, https://doi.org/10.1021/acs.nanolett.4c04500.
Y. Tu, B. Liu, G. Yao, et al., “A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices,” Electronics 13 (2024): 4287, https://doi.org/10.3390/electronics13214287.
C. L. Gan, M.‐H. Chung, L.‐F. Lin, C.‐Y. Huang, and H. Takiar, “Evolution of Epoxy Molding Compounds and Future Carbon Materials for Thermal and Mechanical Stress Management in Memory Device Packaging: A Critical Review,” Journal of Materials Science: Materials in Electronics 34 (2023): 2011, https://doi.org/10.1007/s10854‐023‐11388‐5.
A. K. Singh, B. P. Panda, S. Mohanty, S. K. Nayak, and M. K. Gupta, “Recent Developments on Epoxy‐Based Thermally Conductive Adhesives (TCA): A Review,” Polymer‐Plastics Technology and Engineering 57 (2018): 903–934, https://doi.org/10.1080/03602559.2017.1354253.
M.‐H. Zhou, G.‐Z. Yin, and S. González Prolongo, “Review of Thermal Conductivity in Epoxy Thermosets and Composites: Mechanisms, Parameters, and Filler Influences,” Advanced Industrial and Engineering Polymer Research 7 (2024): 295–308, https://doi.org/10.1016/j.aiepr.2023.08.003.
G. Chang, S. Zhang, K. Chen, et al., “Achieving Excellent Thermal Transport in Diamond/Cu Composites by Breaking Bonding Strength‐Heat Transfer Trade‐off Dilemma at the Interface,” Composites Part B: Engineering 289 (2025): 111925, https://doi.org/10.1016/j.compositesb.2024.111925.
L. Wang, G. Bai, N. Li, et al., “Unveiling Interfacial Structure and Improving Thermal Conductivity of Cu/Diamond Composites Reinforced with Zr‐Coated Diamond Particles,” Vacuum 202 (2022): 111133, https://doi.org/10.1016/j.vacuum.2022.111133.
Y. Zhang, Z. Wang, N. Li, et al., “Interfacial Thermal Conductance Between Cu and Diamond with Interconnected W−W2C Interlayer,” ACS Applied Materials & Interfaces 14 (2022): 35215–35228, https://doi.org/10.1021/acsami.2c07190.
M. J. Meziani, W.‐L. Song, P. Wang, et al., “Boron Nitride Nanomaterials for Thermal Management Applications,” Chemphyschem 16 (2015): 1339–1346, https://doi.org/10.1002/cphc.201402814.
H. Yang, H. Fang, H. Yu, et al., “Low Temperature Self‐Densification of High Strength Bulk Hexagonal Boron Nitride,” Nature Communications 10 (2019): 854, https://doi.org/10.1038/s41467‐019‐08580‐9.
T. F. Retajczyk Jr and A. K. Sinha, “Elastic Stiffness and Thermal Expansion Coefficient of BN Films,” Applied Physics Letters 36 (1980): 161–163, https://doi.org/10.1063/1.91415.
J. A. Cuenca, S. Mandal, D. J. Morgan, M. Snowball, A. Porch, and O. A. Williams, “Dielectric Spectroscopy of Hydrogen‐Treated Hexagonal Boron Nitride Ceramics,” ACS Applied Electronic Materials 2 (2020): 1193–1202, https://doi.org/10.1021/acsaelm.9b00767.
Y. Ji, C. Pan, M. Zhang, et al., “Boron Nitride as Two Dimensional Dielectric: Reliability and Dielectric Breakdown,” Applied Physics Letters 108 (2016): 012905, https://doi.org/10.1063/1.4939131.
D. G. Onn, A. Witek, Y. Z. Qiu, T. R. Anthony, and W. F. Banholzer, “Some Aspects of the Thermal Conductivity of Isotopically Enriched Diamond Single Crystals,” Physical Review Letters 68 (1992): 2806–2809, https://doi.org/10.1103/PhysRevLett.68.2806.
J. R. Olson, R. O. Pohl, J. W. Vandersande, A. Zoltan, T. R. Anthony, and W. F. Banholzer, “Thermal Conductivity of Diamond Between 170 and 1200 K and the Isotope Effect,” Physical Review B 47 (1993): 14850–14856, https://doi.org/10.1103/PhysRevB.47.14850.
L. Wei, P. K. Kuo, R. L. Thomas, T. R. Anthony, and W. F. Banholzer, “Thermal Conductivity of Isotopically Modified Single Crystal Diamond,” Physical Review Letters 70 (1993): 3764–3767, https://doi.org/10.1103/PhysRevLett.70.3764.
P. Jacobson and S. Stoupin, “Thermal Expansion Coefficient of Diamond in a Wide Temperature Range,” Diamond and Related Materials 97 (2019): 107469, https://doi.org/10.1016/j.diamond.2019.107469.
S. Bhagavantam and D. A. A. S. Narayana Rao, “Dielectric Constant of Diamond,” Nature 161 (1948): 729, https://doi.org/10.1038/161729a0.
C. J. H. Wort and R. S. Balmer, “Diamond as an Electronic Material,” Materials Today 11 (2008): 22–28, https://doi.org/10.1016/S1369‐7021(07)70349‐8.
S. Zhang, M. Ding, L. Wang, W. Ge, and W. Yan, “Laser Powder Bed Fusion of Diamond/N6 MMCs Enabled by Ni‐Ti Coated Diamond Particles,” Materials & Design 217 (2022): 110635, https://doi.org/10.1016/j.matdes.2022.110635.
H. Li, C. Wang, W. Ding, et al., “Microstructure Evolution of Diamond with Molybdenum Coating and Thermal Conductivity of Diamond/Copper Composites Fabricated by Spark Plasma Sintering,” Journal of Materials Science: Materials in Electronics 33 (2022): 15369–15384, https://doi.org/10.1007/s10854‐022‐08441‐0.
Z. Jiao, L. Zhang, Z. Deng, et al., “Highly Conductive Diamond Skeleton Reinforced Cu‐Matrix Composites for High‐Efficiency Thermal Management,” Applied Surface Science 645 (2024): 158829, https://doi.org/10.1016/j.apsusc.2023.158829.
M. Malakoutian, D. Field, H. N. E, et al., “Record‐Low Thermal Boundary Resistance Between Diamond and GaN‐on‐SiC for Enabling Radiofrequency Device Cooling,” ACS Applied Materials & Interfaces 13 (2021): 60553–60560, https://doi.org/10.1021/acsami.1c13833.
J. Sang, W. Yang, H. Chen, et al., “Metallurgical Behaviors of Tungsten Coatings at Diamond/Al Interface and Its Influence on Thermal Conductivity and Stability of Diamond/Al Composites,” Journal of Alloys and Compounds 1021 (2025): 179539, https://doi.org/10.1016/j.jallcom.2025.179539.
N. Li, J. Hao, Y. Zhang, et al., “Thermal Conductivity Stability of Interfacial in Situ Al4C3 Engineered Diamond/Al Composites Subjected to Thermal Cycling,” Materials 15 (2022): 6640, https://doi.org/10.3390/ma15196640.
C. Zeng, J. Shen, M. Gong, and H. Chen, “Enhanced Thermal Conductivity in TiC/Diamond or Cr3C2/Diamond Particles Modified Bi‐In‐Sn Compounds,” Journal of Materials Science: Materials in Electronics 32 (2021): 13205–13219, https://doi.org/10.1007/s10854‐021‐05859‐w.
N. Si, Q. Yan, and H. Zhang, “Surface‐Metallized Diamond/Liquid Metal Composites Through Diamond Size Engineering as High‐Performance Thermal Interface Materials,” Surfaces and Interfaces 60 (2025), 105989, https://doi.org/10.1016/j.surfin.2025.105989.
H. Wang, F. Huang, W. Qin, et al., “Effect of Diamond Morphology on Construction of Thermal Conduction Path in Flexible Thermal Interface Materials,” Journal of Materials Engineering and Performance 33 (2024): 11104–11112, https://doi.org/10.1007/s11665‐023‐08724‐5.
Y. Li, X. Liao, X. Guo, et al., “Improving Thermal Conductivity of Epoxy‐Based Composites by Diamond‐Graphene Binary Fillers,” Diamond and Related Materials 126 (2022): 109141, https://doi.org/10.1016/j.diamond.2022.109141.
T. Yoshitomi, T. Matsumoto, and T. Nishino, “Highly Thermally Conductive Nanocomposites Prepared by the Ice‐Templating Alignment of Nanodiamonds in the Thickness Direction,” ACS Applied Polymer Materials 5 (2023): 8349–8358, https://doi.org/10.1021/acsapm.3c01503.
D. Wu, C. Wang, X. Hu, and W. Chen, “Fabrication and Characterization of Highly Thermal Conductive Si3N4/Diamond Composite Materials,” Materials & Design 225 (2023): 111482, https://doi.org/10.1016/j.matdes.2022.111482.
D. Wu, H. Ding, Z.‐Q. Fan, P.‐Z. Jia, H.‐Q. Xie, and X.‐K. Chen, “High Interfacial Thermal Conductance Across Heterogeneous GaN/Graphene Interface,” Applied Surface Science 581 (2022): 152344, https://doi.org/10.1016/j.apsusc.2021.152344.
I. Meric, M. Y. Han, A. F. Young, B. Ozyilmaz, P. Kim, and K. L. Shepard, “Current Saturation in Zero‐Bandgap, Top‐Gated Graphene Field‐Effect Transistors,” Nature Nanotechnology 3 (2008): 654–659, https://doi.org/10.1038/nnano.2008.268.
S. Wieghold, J. Li, P. Simon, et al., “Photoresponse of Supramolecular Self‐Assembled Networks on Graphene–Diamond Interfaces,” Nature Communications 7 (2016): 10700, https://doi.org/10.1038/ncomms10700.
A. Nie, Z. Zhao, B. Xu, and Y. Tian, “Microstructure Engineering in Diamond‐Based Materials,” Nature Materials 24 (2025): 1172–1185, https://doi.org/10.1038/s41563‐025‐02168‐z.
X. Li, D. Jin, S. Ding, and G. Yang, “High Interfacial Thermal Conductance in Graphite‐Diamond Hybrids,” Journal of Physical Chemistry C 128 (2024): 14500–14506, https://doi.org/10.1021/acs.jpcc.4c03868.
H. Zhang, Q. He, H. Yu, M. Qin, Y. Feng, and W. Feng, “A Bioinspired Polymer‐Based Composite Displaying Both Strong Adhesion and Anisotropic Thermal Conductivity,” Advanced Functional Materials 33 (2023): 2211985, https://doi.org/10.1002/adfm.202211985.
M. Li, Y. Sun, D. Feng, K. Ruan, X. Liu, and J. Gu, “Thermally Conductive Polyvinyl Alcohol Composite Films via Introducing Hetero‐Structured MXene@Silver Fillers,” Nano Research 16 (2023): 7820–7828, https://doi.org/10.1007/s12274‐023‐5594‐1.
R. Kang, Z. Zhang, L. Guo, et al., “Enhanced Thermal Conductivity of Epoxy Composites Filled with 2D Transition Metal Carbides (MXenes) with Ultralow Loading,” Scientific Reports 9 (2019): 9135, https://doi.org/10.1038/s41598‐019‐45664‐4.
H. Yu, Y. Feng, C. Chen, et al., “Highly Thermally Conductive Adhesion Elastomer Enhanced by Vertically Aligned Folded Graphene,” Advanced Science 9 (2022): 2201331, https://doi.org/10.1002/advs.202201331.
Z. Lin, Y. Liu, S. Raghavan, K. Moon, S. K. Sitaraman, and C. Wong, “Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation,” ACS Applied Materials & Interfaces 5 (2013): 7633–7640, https://doi.org/10.1021/am401939z.
J. Yuan, X. Qian, Z. Meng, B. Yang, and Z.‐Q. Liu, “Highly Thermally Conducting Polymer‐Based Films with Magnetic Field‐Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation,” ACS Applied Materials & Interfaces 11 (2019): 17915–17924, https://doi.org/10.1021/acsami.9b06062.
X. Ma, H. Zhang, Y. Guo, et al., “Enhancing Thermal Conductivity in Polysiloxane Composites through Synergistic Design of Liquid Crystals and Boron Nitride Nanosheets,” Journal of Materials Science & Technology 231 (2025): 54–61, https://doi.org/10.1016/j.jmst.2025.01.004.
S. Xu, S. Wang, Z. Chen, et al., “Electric‐Field‐Assisted Growth of Vertical Graphene Arrays and the Application in Thermal Interface Materials,” Advanced Functional Materials 30 (2020): 2003302, https://doi.org/10.1002/adfm.202003302.
D. Du, Y. Hao, and Y. He, “High Frequency Electric‐Field‐Assisted Preparation of BN/Epoxy Resin Composites with Excellent Electrical, Thermal, and Mechanical Properties,” Polymers 17 (2025): 1429, https://doi.org/10.3390/polym17111429.
G. Czel, A. Sycheva, and D. Janovszky, “Effect of Different Fillers on Thermal Conductivity, Tribological Properties of Polyamide 6,” Scientific Reports 13 (2023): 845, https://doi.org/10.1038/s41598‐023‐27740‐y.
S. Jasmee, G. Omar, S. S. C. Othaman, N. A. Masripan, and H. A. Hamid, “Interface Thermal Resistance and Thermal Conductivity of Polymer Composites at Different Types, Shapes, and Sizes of Fillers: A Review,” Polymer Composites 42 (2021): 2629–2652, https://doi.org/10.1002/pc.26029.
X. Wang, X. Niu, X. Wang, X. Qiu, and L. Wang, “Effects of Filler Distribution and Interface Thermal Resistance on the Thermal Conductivity of Composites Filling with Complex Shaped Fillers,” International Journal of Thermal Sciences 160 (2021): 106678, https://doi.org/10.1016/j.ijthermalsci.2020.106678.
F. Liu, R. Mao, Z. Liu, J. Du, and P. Gao, “Probing Phonon Transport Dynamics Across an Interface by Electron Microscopy,” Nature 642 (2025): 941–946, https://doi.org/10.1038/s41586‐025‐09108‐6.
S. Hu, C. Zhao, and X. Gu, “Phonon Non‐Equilibrium Effects on Interface Thermal Resistance Between Graphene and Substrates,” International Journal of Thermal Sciences 196 (2024): 108725, https://doi.org/10.1016/j.ijthermalsci.2023.108725.
S. Shan, Z. Zhang, S. Volz, and J. Chen, “Phonon Mode at Interface and Its Impact on Interfacial Thermal Transport,” Journal of Physics: Condensed Matter 36 (2024): 423001, https://doi.org/10.1088/1361‐648X/ad5fd7.
M. M. Islam and L. Liu, “Enhancing Interfacial Thermal Transport by Grafting H‐Bonded Polymer Chains: The Role of Chain Morphology,” Applied Surface Science 697 (2025): 163009, https://doi.org/10.1016/j.apsusc.2025.163009.
M. D. Losego, M. E. Grady, N. R. Sottos, D. G. Cahill, and P. V. Braun, “Effects of Chemical Bonding on Heat Transport Across Interfaces,” Nature Materials 11 (2012): 502–506, https://doi.org/10.1038/nmat3303.
Y. Liu, L. Qiu, Z. Wang, H. Li, and Y. Feng, “Enhancing Interfacial Thermal Transport Efficiently in Diamond/Graphene Heterostructure by Involving Vacancy Defects,” Composites Part A: Applied Science and Manufacturing 178 (2024): 108008, https://doi.org/10.1016/j.compositesa.2024.108008.
W. Miao and M. Wang, “Importance of Electron‐Phonon Coupling in Thermal Transport in Metal/Semiconductor Multilayer Films,” International Journal of Heat and Mass Transfer 200 (2023): 123538, https://doi.org/10.1016/j.ijheatmasstransfer.2022.123538.
J. Chen, G. Chen, Z. Wang, and D. Tang, “Modulation of Localized Phonon Thermal Transport at GaN/AlxGa1‐xN Heterointerface: Polar Surface, Doping, and Compressive Strain,” International Journal of Heat and Mass Transfer 220 (2024): 124945, https://doi.org/10.1016/j.ijheatmasstransfer.2023.124945.
E. A. Chagarov, M. S. Kavrik, Z. Fang, W. Tsai, and A. C. Kummel, “Density‐Functional Theory Molecular Dynamics Simulations of a‐HfO2/a‐SiO2/SiGe and a‐HfO2/a‐SiO2/Ge with a‐SiO2 and a‐SiO Suboxide Interfacial Layers,” Applied Surface Science 443 (2018): 644–654, https://doi.org/10.1016/j.apsusc.2018.02.041.
Q. Chen, K. Yang, Y. Feng, et al., “Recent Advances in Thermal‐Conductive Insulating Polymer Composites with Various Fillers,” Composites Part A: Applied Science and Manufacturing 178 (2024): 107998, https://doi.org/10.1016/j.compositesa.2023.107998.
Y. P. Mamunya, V. V. Davydenko, P. Pissis, and E. V. Lebedev, “Electrical and Thermal Conductivity of Polymers Filled with Metal Powders,” European Polymer Journal (2002): 1887–1897, https://doi.org/10.1016/S0014‐3057(02)00064‐2.
H. Chen, V. V. Ginzburg, J. Yang, et al., “Thermal Conductivity of Polymer‐Based Composites: Fundamentals and Applications,” Progress in Polymer Science 59 (2016): 41–85, https://doi.org/10.1016/j.progpolymsci.2016.03.001.
T. Ji, Y. Feng, M. Qin, et al., “Thermal Conductive and Flexible Silastic Composite Based on a Hierarchical Framework of Aligned Carbon Fibers‐Carbon Nanotubes,” Carbon 131 (2018): 149–159, https://doi.org/10.1016/j.carbon.2018.02.002.
C. Huang, X. Qian, and R. Yang, “Thermal Conductivity of Polymers and Polymer Nanocomposites,” Materials Science and Engineering: R: Reports 132 (2018): 1–22, https://doi.org/10.1016/j.mser.2018.06.002.
E. T. Swartz and R. O. Pohl, “Thermal Boundary Resistance,” Reviews of Modern Physics 61 (1989): 605–668, https://doi.org/10.1103/RevModPhys.61.605.
M. Hu, P. Keblinski, and P. K. Schelling, “Kapitza Conductance of Silicon–Amorphous Polyethylene Interfaces by Molecular Dynamics Simulations,” Physical Review B 79 (2009): 104305, https://doi.org/10.1103/PhysRevB.79.104305.
T. Lu, J. Zhou, T. Nakayama, R. Yang, and B. Li, “Interfacial Thermal Conductance Across Metal‐Insulator/Semiconductor Interfaces due to Surface States,” Physical Review B 93 (2016): 085433, https://doi.org/10.1103/PhysRevB.93.085433.
S. Goel, X. Luo, A. Agrawal, and R. L. Reuben, “Diamond Machining of Silicon: A Review of Advances in Molecular Dynamics Simulation,” International Journal of Machine Tools and Manufacture 88 (2015): 131–164, https://doi.org/10.1016/j.ijmachtools.2014.09.013.
L.‐Y. Li, L. Qiu, N. Cao, et al., “Revealing the Mechanism of Significant Enhancement in Interfacial Thermal Transport in Silicon‐Based Ceramic Crystalline/Amorphous Matrix Composite Phase Change Materials,” Rare Metals 44 (2025): 4107–4118, https://doi.org/10.1007/s12598‐025‐03301‐2.
X. Wang, X. Wang, Y. Tong, and Y. Wang, “Enhancing Interfacial Thermal Conductivity of Copper‐Carbon Nanotube Array Composite via Metallic Bonding: Molecular Dynamics Simulations,” Chemical Physics 584 (2024): 112341, https://doi.org/10.1016/j.chemphys.2024.112341.
X.‐D. Zhang, G. Yang, and B.‐Y. Cao, “Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications,” Advanced Materials Interfaces 9 (2022): 2200078, https://doi.org/10.1002/admi.202200078.
Z. Liu, X. Sun, J. Xie, X. Zhang, and J. Li, “Interfacial Thermal Transport Properties and Its Effect on Thermal Conductivity of Functionalized BNNS/Epoxy Composites,” International Journal of Heat and Mass Transfer 195 (2022): 123031, https://doi.org/10.1016/j.ijheatmasstransfer.2022.123031.
Y. Jiang, X. Shi, Y. Feng, S. Li, X. Zhou, and X. Xie, “Enhanced Thermal Conductivity and Ideal Dielectric Properties of Epoxy Composites Containing Polymer Modified Hexagonal Boron Nitride,” Composites Part A: Applied Science and Manufacturing 107 (2018): 657–664, https://doi.org/10.1016/j.compositesa.2018.02.016.
T. Feng, J. Cui, M. Ou, et al., “0D‐2D Nanohybrids Based on Binary Transitional Metal Oxide Decorated Boron Nitride Enabled Epoxy Resin Efficient Flame Retardant Coupled with Enhanced Thermal Conductivity at Ultra‐Low Additions,” Composites Communications 41 (2023): 101649, https://doi.org/10.1016/j.coco.2023.101649.
W. Shen, W. Wu, C. Liu, Z. Wang, and Z. Huang, “Achieving a High Thermal Conductivity for Segregated BN/PLA Composites via Hydrogen Bonding Regulation Through Cellulose Network,” Polymers for Advanced Technologies 31 (2020): 1911–1920, https://doi.org/10.1002/pat.4916.
Z. Ji, W. Liu, C. Ouyang, and Y. Li, “High Thermal Conductivity Thermoplastic Polyurethane/Boron Nitride/Liquid Metal Composites: The Role of the Liquid Bridge at the Filler/Filler Interface,” Materials Advances 2 (2021): 5977–5985, https://doi.org/10.1039/D1MA00637A.
Q. Chi, X. Zhang, X. Wang, et al., “High Thermal Conductivity of Epoxy‐Based Composites Utilizing 3D Porous Boron Nitride Framework,” Composites Communications 33 (2022): 101195, https://doi.org/10.1016/j.coco.2022.101195.
W. Yang, M. Zhang, K. Wang, et al., “Reducing Interfacial Thermal Resistance between Epoxy and Alumina via Interfacial Engineering,” Physica Status Solidi (a) 220 (2023): 2200800, https://doi.org/10.1002/pssa.202200800.
S. Bakalakos, I. Kalogeris, and V. Papadopoulos, “An Extended Finite Element Method Formulation for Modeling Multi‐Phase Boundary Interactions in Steady State Heat Conduction Problems,” Composite Structures 258 (2021): 113202, https://doi.org/10.1016/j.compstruct.2020.113202.
M. S. Dresselhaus, G. Dresselhaus, R. Saito, and A. Jorio, “Raman Spectroscopy of Carbon Nanotubes,” Physics Reports 409 (2005): 47–99, https://doi.org/10.1016/j.physrep.2004.10.006.
J.‐H. Kim, A. R. T. Nugraha, L. G. Booshehri, et al., “Coherent Phonons in Carbon Nanotubes and Graphene,” Chemical Physics 413 (2013): 55–80, https://doi.org/10.1016/j.chemphys.2012.09.017.
J. Chen, J. He, D. Pan, et al., “Emerging Theory and Phenomena in Thermal Conduction: A Selective Review,” Science China Physics, Mechanics & Astronomy 65 (2022): 117002, https://doi.org/10.1007/s11433‐022‐1952‐3.
A. Badakhsh, Y.‐M. Lee, K. Y. Rhee, C. W. Park, K.‐H. An, and B.‐J. Kim, “Improvement of Thermal, Electrical and Mechanical Properties of Composites Using a Synergistic Network of Length Controlled‐CNTs and Graphene Nanoplatelets,” Composites Part B: Engineering 175 (2019): 107075, https://doi.org/10.1016/j.compositesb.2019.107075.
Q. Kong, L. Bodelot, B. Lebental, et al., “Novel Three‐Dimensional Carbon Nanotube Networks as High Performance Thermal Interface Materials,” Carbon 132 (2018): 359–369, https://doi.org/10.1016/j.carbon.2018.02.052.
M. Safdari and M. S. Al‐Haik, “Synergistic Electrical and Thermal Transport Properties of Hybrid Polymeric Nanocomposites Based on Carbon Nanotubes and Graphite Nanoplatelets,” Carbon 64 (2013): 111–121, https://doi.org/10.1016/j.carbon.2013.07.042.
L. Jing, M. K. Samani, B. Liu, et al., “Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays,” ACS Applied Materials & Interfaces 9 (2017): 14555–14560, https://doi.org/10.1021/acsami.7b02154.
X. He, Y. Huang, C. Wan, et al., “Enhancing Thermal Conductivity of Polydimethylsiloxane Composites Through Spatially Confined Network of Hybrid Fillers,” Composites Science and Technology 172 (2019): 163–171, https://doi.org/10.1016/j.compscitech.2019.01.009.
K. Kalaitzidou, H. Fukushima, and L. T. Drzal, “Multifunctional Polypropylene Composites Produced by Incorporation of Exfoliated Graphite Nanoplatelets,” Carbon 45 (2007): 1446–1452, https://doi.org/10.1016/j.carbon.2007.03.029.
S. K. Bhattacharya and A. C. D. Chaklader, “Review on Metal‐Filled Plastics. Part 2. Thermal Properties,” Polymer‐Plastics Technology and Engineering 20 (1983): 35–59, https://doi.org/10.1080/03602558308067736.
S. Pradhan, R. Lach, H. H. Le, W. Grellmann, H.‐J. Radusch, and R. Adhikari, “Effect of Filler Dimensionality on Mechanical Properties of Nanofiller Reinforced Polyolefin Elastomers,” International Scholarly Research Notices 2013 (2013): 284504, https://doi.org/10.1155/2013/284504.
W. Si, J. Sun, X. He, et al., “Enhancing Thermal Conductivity via Conductive Network Conversion from High to Low Thermal Dissipation in Polydimethylsiloxane Composites,” Journal of Materials Chemistry C 8 (2020): 3463–3475, https://doi.org/10.1039/C9TC06968B.
K. Pashayi, H. R. Fard, F. Lai, S. Iruvanti, J. Plawsky, and T. Borca‐Tasciuc, “High Thermal Conductivity Epoxy‐Silver Composites Based on Self‐Constructed Nanostructured Metallic Networks,” Journal of Applied Physics 111 (2012): 104310, https://doi.org/10.1063/1.4716179.
B. L. Zhu, H. Zheng, J. Wang, J. Ma, J. Wu, and R. Wu, “Tailoring of Thermal and Dielectric Properties of LDPE‐Matrix Composites by the Volume Fraction, Density, and Surface Modification of Hollow Glass Microsphere Filler,” Composites Part B: Engineering 58 (2014): 91–102, https://doi.org/10.1016/j.compositesb.2013.10.029.
Z. Qi, W. Shen, R. Li, et al., “AlN/Diamond Interface Nanoengineering for Reducing Thermal Boundary Resistance by Molecular Dynamics Simulations,” Applied Surface Science 615 (2023): 156419, https://doi.org/10.1016/j.apsusc.2023.156419.
E. Lee, T. Zhang, T. Yoo, Z. Guo, and T. Luo, “Nanostructures Significantly Enhance Thermal Transport Across Solid Interfaces,” ACS Applied Materials & Interfaces 8 (2016): 35505–35512, https://doi.org/10.1021/acsami.6b12947.
W. Luo, N. Wang, W. Lian, E. Yin, and Q. Li, “Enhancing Interfacial Thermal Transport by Nanostructures: Monte Carlo Simulations with Ab Initio Phonon Properties,” Fluid Dynamics arXiv (2024): 240619068, https://doi.org/10.48550/arXiv.2406.19068.
Z. Wang, L. Wei, X. Wang, et al., “Interfacial Regulation to Improve Interface Heat Transfer of Al/Diamond Composites Based on Molecular Dynamics Simulations,” Diamond and Related Materials 153 (2025): 112029, https://doi.org/10.1016/j.diamond.2025.112029.
W. Park, A. Sood, J. Park, M. Asheghi, R. Sinclair, and K. E. Goodson, “Enhanced Thermal Conduction through Nanostructured Interfaces,” Nanoscale and Microscale Thermophysical Engineering 21 (2017): 134–144, https://doi.org/10.1080/15567265.2017.1296910.
Z. Cheng, T. Bai, J. Shi, et al., “Tunable Thermal Energy Transport Across Diamond Membranes and Diamond–Si Interfaces by Nanoscale Graphoepitaxy,” ACS Applied Materials & Interfaces 11 (2019): 18517–18527, https://doi.org/10.1021/acsami.9b02234.
Y.‐C. Hua and B.‐Y. Cao, “Study of Phononic Thermal Transport Across Nanostructured Interfaces Using Phonon Monte Carlo Method,” International Journal of Heat and Mass Transfer 154 (2020): 119762, https://doi.org/10.1016/j.ijheatmasstransfer.2020.119762.
Q. Li, F. Liu, S. Hu, et al., “Inelastic Phonon Transport Across Atomically Sharp Metal/Semiconductor Interfaces,” Nature Communications 13 (2022): 4901, https://doi.org/10.1038/s41467‐022‐32600‐w.
C. A. Polanco and L. Lindsay, “Phonon Thermal Conductance Across GaN‐AlN Interfaces from First Principles,” Physical Review B 99 (2019): 075202, https://doi.org/10.1103/PhysRevB.99.075202.
R. Wu, X. Zhao, and Y. Liu, “Atomic Insights of Cu Nanoparticles Melting and Sintering Behavior in CuCu Direct Bonding,” Materials & Design 197 (2021): 109240, https://doi.org/10.1016/j.matdes.2020.109240.
R. Luo, D. Hu, C. Qian, et al., “Molecular Dynamics Simulations on Mechanical Behaviors of Sintered Nanocopper in Power Electronics Packaging,” Microelectronics Reliability 152 (2024): 115284, https://doi.org/10.1016/j.microrel.2023.115284.
D. Hu, C. Qian, X. Liu, et al., “High Temperature Viscoplastic Deformation Behavior of Sintered Nanocopper Paste Used in Power Electronics Packaging: Insights from Constitutive and Multi‐Scale Modelling,” Journal of Materials Research and Technology 26 (2023): 3183–3200, https://doi.org/10.1016/j.jmrt.2023.08.086.
S. Liu, S. Zhao, D. Zhang, et al., “Molecular Dynamics Analysis of the Solid‐State Bonding Mechanism and High Strain Rate Response for (1 1 1)‐Oriented Nanotwinned Silver,” ACS Applied Materials & Interfaces 17, no. 15 (2025): 23308–23321, https://doi.org/10.1021/acsami.5c00590.
Z. Zhang, G. Fu, B. Wan, Y. Su, and M. Jiang, “Research on Sintering Process and Thermal Conductivity of Hybrid Nanosilver Solder Paste Based on Molecular Dynamics Simulation,” Microelectronics Reliability 126 (2021): 114203, https://doi.org/10.1016/j.microrel.2021.114203.
Q. Jia, G. Zou, H. Zhang, et al., “Sintering Mechanism of Ag‐Pd Nanoalloy Film for Power Electronic Packaging,” Applied Surface Science 554 (2021): 149579, https://doi.org/10.1016/j.apsusc.2021.149579.
X. Hu, J. Huang, R. Poelma, W. Driel, and Z. G. D, “Sintering Process Simulation of Ag Nanoparticles by Phase Field Method,” in 2024 25th International Conference on Thermal, Mechanical and Multi‐Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), (IEEE, 2024), https://doi.org/10.1109/EuroSimE60745.2024.10491517.
M. Xue and M. Yi, “Phase‐Field Simulation of Sintering Process: A Review,” Computer Modeling in Engineering & Sciences 140 (2024): 1165–1204, https://doi.org/10.32604/cmes.2024.049367.
K. Ahmed, J. Pakarinen, T. Allen, and A. El‐Azab, “Phase Field Simulation of Grain Growth in Porous Uranium Dioxide,” Journal of Nuclear Materials 446 (2014): 90–99, https://doi.org/10.1016/j.jnucmat.2013.11.036.
K. Chockalingam, V. G. Kouznetsova, O. van der Sluis, and M. G. D. Geers, “2D Phase Field Modeling of Sintering of Silver Nanoparticles,” Computer Methods in Applied Mechanics and Engineering 312 (2016): 492–508, https://doi.org/10.1016/j.cma.2016.07.002.
X. Chen, L. Yang, Y. Zhang, et al., “A Comprehensive Model for Spinodal Decomposition in Ag–Cu Alloys Based on Phase‐Field Theory and In Situ TEM,” ACS Applied Materials & Interfaces 17 (2025): 54263–54281, https://doi.org/10.1021/acsami.5c13603.
C. Cao, M. Yang, C. Liang, et al., “A Phase‐Field Model of Electrochemical Migration for Silver‐Based Conductive Adhesives,” Electrochimica Acta 471 (2023): 143388, https://doi.org/10.1016/j.electacta.2023.143388.
J. W. Cahn, “On Spinodal Decomposition,” Acta Metallurgica 9 (1961): 795–801, https://doi.org/10.1016/0001‐6160(61)90182‐1.
J. W. Cahn and S. M. Allen, “A Microscopic Theory for Domain Wall Motion and Its Experimental Verification in Fe‐Al Alloy Domain Growth Kinetics,” in The Selected Works of John W. Cahn, (John Wiley & Sons, 1998), https://doi.org/10.1002/9781118788295.ch36.
V. Kumar, Z. Z. Fang, and P. C. Fife, “Phase Field Simulations of Grain Growth During Sintering of Two Unequal‐Sized Particles,” Materials Science and Engineering: A 528 (2010): 254–259, https://doi.org/10.1016/j.msea.2010.08.061.
J. Deng, “A Phase Field Model of Sintering with Direction‐Dependent Diffusion,” Materials Transactions 53 (2012): 385–389, https://doi.org/10.2320/matertrans.M2011317.
S. Biswas, D. Schwen, J. Singh, and V. Tomar, “A Study of the Evolution of Microstructure and Consolidation Kinetics During Sintering Using a Phase Field Modeling Based Approach,” Extreme Mechanics Letters 7 (2016): 78–89, https://doi.org/10.1016/j.eml.2016.02.017.
Y. U. Wang, “Computer Modeling and Simulation of Solid‐State Sintering: A Phase Field Approach,” Acta Materialia 54 (2006): 953–961, https://doi.org/10.1016/j.actamat.2005.10.032.
S. Biswas, D. Schwen, and V. Tomar, “Implementation of a Phase Field Model for Simulating Evolution of Two Powder Particles Representing Microstructural Changes During Sintering,” Journal of Materials Science 53 (2018): 5799–5825, https://doi.org/10.1007/s10853‐017‐1846‐3.
S. Liang, C. Liu, H. Jiang, and Z. Zhong, “Investigation of Electrical–Thermal–Mechanical Effects in Electric‐Assisted Silver Sintering Process through Phase Field Modeling,” IEEE Transactions on Components, Packaging and Manufacturing Technology 13 (2023): 1764–1769, https://doi.org/10.1109/TCPMT.2023.3327375.
S. Y. Hu and L. Q. Chen, “A Phase‐Field Model for Evolving Microstructures with Strong Elastic Inhomogeneity,” Acta Materialia 49 (2001): 1879–1890, https://doi.org/10.1016/S1359‐6454(01)00118‐5.
J. W. Cahn, “Phase Separation by Spinodal Decomposition in Isotropic Systems,” Journal of Chemical Physics 42 (1965): 93–99, https://doi.org/10.1063/1.1695731.
D. J. Seol, S. Y. Hu, Y. L. Li, J. Shen, K. H. Oh, and L. Q. Chen, “Computer Simulation of Spinodal Decomposition in Constrained Films,” Acta Materialia 51 (2003): 5173–5185, https://doi.org/10.1016/S1359‐6454(03)00378‐1.
D. J. Seol, S. Y. Hu, K. H. Oh, and L. Q. Chen, “Effect of Substrate Constraint on Spinodal Decomposition in an Elastically Inhomogeneous Thin Film,” Metals and Materials International 10 (2004): 429–434, https://doi.org/10.1007/BF03027344.
J. A. Stewart and R. Dingreville, “Microstructure Morphology and Concentration Modulation of Nanocomposite Thin‐Films During Simulated Physical Vapor Deposition,” Acta Materialia 188 (2020): 181–191, https://doi.org/10.1016/j.actamat.2020.02.011.
Y. Lu, B. Derby, H. Sriram, et al., “Microstructure Development and Morphological Transition During Deposition of Immiscible Alloy Films,” Acta Materialia 220 (2021): 117313, https://doi.org/10.1016/j.actamat.2021.117313.
J. L. Li, Z. Li, Q. Wang, C. Dong, and P. K. Liaw, “Phase‐Field Simulation of Coherent BCC/B2 Microstructures in High Entropy Alloys,” Acta Materialia 197 (2020): 10–19, https://doi.org/10.1016/j.actamat.2020.07.030.
K. Kadirvel, H. L. Fraser, and Y. Wang, “Microstructural Design via Spinodal‐Mediated Phase Transformation Pathways in High‐Entropy Alloys (HEAs) Using Phase‐Field Modelling,” Acta Materialia 243 (2023): 118438, https://doi.org/10.1016/j.actamat.2022.118438.
S. R. Koneru, K. Kadirvel, H. Fraser, and Y. Wang, “Microstructural Engineering by Heat Treatments of Multi‐Principal Element Alloys via Spinodal Mediated Phase Transformation Pathways,” Acta Materialia 258 (2023): 119198, https://doi.org/10.1016/j.actamat.2023.119198.
L. Chen, H. W. Zhang, L. Y. Liang, et al., “Modulation of Dendritic Patterns During Electrodeposition: A Nonlinear Phase‐Field Model,” Journal of Power Sources 300 (2015): 376–385, https://doi.org/10.1016/j.jpowsour.2015.09.055.
A. Jana, S. I. Woo, K. S. N. Vikrant, and R. E. García, “Electrochemomechanics of Lithium Dendrite Growth,” Energy & Environmental Science 12 (2019): 3595–3607, https://doi.org/10.1039/C9EE01864F.
Z. Mu, Z. Guo, and Y.‐H. Lin, “Simulation of 3‐D Lithium Dendritic Evolution Under Multiple Electrochemical States: A Parallel Phase Field Approach,” Energy Storage Materials 30 (2020): 52–58, https://doi.org/10.1016/j.ensm.2020.04.011.
C. Lin, K. Liu, H. Ruan, and B. Wang, “Mechano‐Electrochemical Phase Field Modeling for Formation and Modulation of Dendritic Pattern: Application to Uranium Recovery from Spent Nuclear Fuel,” Materials & Design 213 (2022): 110322, https://doi.org/10.1016/j.matdes.2021.110322.
B. Illés, B. Medgyes, K. Dušek, D. Bušek, A. Skwarek, and A. Géczy, “Numerical Simulation of Electrochemical Migration of Cu Based on the Nernst‐Plank Equation,” International Journal of Heat and Mass Transfer 184 (2022): 122268, https://doi.org/10.1016/j.ijheatmasstransfer.2021.122268.
S. Zhao, M. Yang, Y. Liu, et al., “The Anti‐Electrochemical Migration Mechanism of Ag‐Based Transient Liquid‐Phase Electrically Conductive Adhesive: Experimental and Phase‐Field Study,” Applied Surface Science 696 (2025): 162998, https://doi.org/10.1016/j.apsusc.2025.162998.
Y. Liu, S. Irving, T. Luk, and D. Kinzer, “Trends of Power Electronic Packaging and Modeling,” in 2008 10th Electronics Packaging Technology Conference (IEEE, 2008), https://doi.org/10.1109/EPTC.2008.4763404.
Y. Wang, H. Liu, L. Huo, et al., “Research on the Reliability of Advanced Packaging Under Multi‐Field Coupling: A Review,” Micromachines 15 (2024): 422, https://doi.org/10.3390/mi15040422.
Y. Liu, Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling, (Springer Science & Business Media, 2012), https://doi.org/10.1007/978‐1‐4614‐1053‐9.
G. Mauromicale, M. Calabretta, G. Scarcella, G. Scelba, and A. Sitta, “Multi‐Physics Models of a Low‐Voltage Power Semiconductor System‐in‐Package for Automotive Applications,” Journal of Electronic Packaging 145 (2023): 031003, https://doi.org/10.1115/1.4056413.
J. Song, S. Hu, and Y. Liu, “A Laser Assisted Bonding Process Design with Silver‐Indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging,” in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (IEEE, 2022), https://doi.org/10.1109/ICEPT56209.2022.9873195.
S. Hu, J. Song, Y. Liu, et al., “A Laser‐Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging,” IEEE Transactions on Components, Packaging and Manufacturing Technology 14 (2024): 328–341, https://doi.org/10.1109/TCPMT.2024.3355159.
Y. Jia, F. Xiao, Y. Duan, Y. Luo, B. Liu, and Y. Huang, “PSpice‐COMSOL‐Based 3‐D Electrothermal–Mechanical Modeling of IGBT Power Module,” IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (2020): 4173–4185, https://doi.org/10.1109/JESTPE.2019.2935037.
X. Zhao, Y. Xu, and D. C. Hopkins, “Advanced Multi‐Physics Simulation for High Performance Power Electronic Packaging Design,” in 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D‐PEIM) (IEEE, 2016), https://doi.org/10.1109/3DPEIM.2016.8048203.
B. Yu and Y. Gao, “Multi‐Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging,” Chips 1 (2022): 191–209, https://doi.org/10.3390/chips1030013.
D. Li, M. Packwood, and F. Qi, “2016 17th International Conference on Thermal, Mechanical and Multi‐Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),” (IEEE, 2016), https://doi.org/10.1109/EuroSimE.2016.7463369.
Y. Liu and D. Kinzer, “Challenges of Power Electronic Packaging and Modeling,” in 2011 12th International Conference on Thermal, Mechanical & Multi‐Physics Simulation and Experiments in Microelectronics and Microsystems (IEEE, 2011), https://doi.org/10.1109/ESIME.2011.5765799.
J. A. Elliott, “Novel Approaches to Multiscale Modelling in Materials Science,” International Materials Reviews 56 (2011): 207–225, https://doi.org/10.1179/1743280410Y.0000000002.
K. Momeni, Y. Ji, Y. Wang, et al., “Multiscale Computational Understanding and Growth of 2D Materials: A Review,” npj Computational Materials 6 (2020): 22, https://doi.org/10.1038/s41524‐020‐0280‐2.
S. Kohlhoff, P. Gumbsch, and H. F. Fischmeister, “Crack Propagation in b.c.c. Crystals Studied with a Combined Finite‐Element and Atomistic Model,” Philosophical Magazine A 64 (1991): 851–878, https://doi.org/10.1080/01418619108213953.
R. E. Rudd, “Coarse‐Grained Molecular Dynamics: Nonlinear Finite Elements and Finite Temperature,” Physical Review B 72 (2005): 144104, https://doi.org/10.1103/PhysRevB.72.144104.
R. U. Patil, B. K. Mishra, I. V. Singh, and T. Q. Bui, “A New Multiscale Phase Field Method to Simulate Failure in Composites,” Advances in Engineering Software 126 (2018): 9–33, https://doi.org/10.1016/j.advengsoft.2018.08.010.
D. Molnar, R. Mukherjee, A. Choudhury, et al., “Multiscale Simulations on the Coarsening of Cu‐Rich Precipitates in α‐Fe Using Kinetic Monte Carlo, Molecular Dynamics and Phase‐Field Simulations,” Acta Materialia 60 (2012): 6961–6971, https://doi.org/10.1016/j.actamat.2012.08.051.
W. E, H. Lei, P. Xie, and L. Zhang, “Machine Learning‐Assisted Multi‐Scale Modeling,” Journal of Mathematical Physics 64 (2023): 071101, https://doi.org/10.1063/5.0149861.
C. Na, S. Shin, D. Lee, et al., “Data‐Driven Engineering and Analysis of Polymer Composites with High Thermal Conductivity,” Composites Science and Technology 272 (2025): 111400, https://doi.org/10.1016/j.compscitech.2025.111400.
M. Capone, M. Romanelli, D. Castaldo, et al., “A Vision for the Future of Multiscale Modeling,” ACS Physical Chemistry Au 4 (2024): 202–225, https://doi.org/10.1021/acsphyschemau.3c00080.
D. M. Kochmann and J. S. Amelang, “The Quasicontinuum Method: Theory and Applications,” in Multiscale Materials Modeling for Nanomechanics, ed. C. R. Weinberger and G. J. Tucker (Springer International Publishing, 2016), https://doi.org/10.1007/978‐3‐319‐33480‐6_5.
O. Rokoš, R. H. J. Peerlings, and J. Zeman, “eXtended Variational Quasicontinuum Methodology for Lattice Networks with Damage and Crack Propagation,” Computer Methods in Applied Mechanics and Engineering 320 (2017): 769–792, https://doi.org/10.1016/j.cma.2017.03.042.
A. Muixí, O. Marco, A. Rodríguez‐Ferran, and S. Fernández‐Méndez, “A Combined XFEM Phase‐Field Computational Model for Crack Growth without Remeshing,” Computational Mechanics 67 (2021): 231–249, https://doi.org/10.1007/s00466‐020‐01929‐8.
R. Perera and V. Agrawal, “Multiscale Graph Neural Networks with Adaptive Mesh Refinement for Accelerating Mesh‐Based Simulations,” Computer Methods in Applied Mechanics and Engineering 429 (2024): 117152, https://doi.org/10.1016/j.cma.2024.117152.
P. C. H. Nguyen, J. B. Choi, H. S. Udaykumar, and S. Baek, “Challenges and Opportunities for Machine Learning in Multiscale Computational Modeling,” Journal of Computing and Information Science in Engineering 23 (2023): 060808, https://doi.org/10.1115/1.4062495.
D. Bishara, Y. Xie, W. Liu, and S. Li, “A State‐of‐the‐Art Review on Machine Learning‐Based Multiscale Modeling, Simulation, Homogenization and Design of Materials,” Archives of Computational Methods in Engineering 30 (2023): 191–222, https://doi.org/10.1007/s11831‐022‐09795‐8.
J. Linghu, H. Dong, Y. Nie, and J. Cui, “Higher‐Order Multi‐Scale Deep Ritz Method (HOMS‐DRM) and Its Convergence Analysis for Solving Thermal Transfer Problems of Composite Materials,” Computational Mechanics 75 (2025): 71–95, https://doi.org/10.1007/s00466‐024‐02491‐3.
A. K. Chew, M. A. F. Afzal, Z. Kaplan, et al., “Leveraging High‐Throughput Molecular Simulations and Machine Learning for the Design of Chemical Mixtures,” npj Computational Materials 11 (2025): 72, https://doi.org/10.1038/s41524‐025‐01552‐2.
Y. Liu, W. Hong, and B. Cao, “Machine Learning for Predicting Thermodynamic Properties of Pure Fluids and Their Mixtures,” Energy 188 (2019): 116091, https://doi.org/10.1016/j.energy.2019.116091.
H. Zhou and T. Feng, “Theoretical Upper Limits of the Thermal Conductivity of Si3N4,” Applied Physics Letters 122 (2023): 182203, https://doi.org/10.1063/5.0149298.
S. Jasmee, G. Omar, S. S. C. Othaman, N. A. A. Masripan, and H. Hamid, “Interface Thermal Resistance and Thermal Conductivity of Polymer Composites at Different Types, Shapes, and Sizes of Fillers: A Review,” Polymer Composites (2021): 2629–2652, https://doi.org/10.1002/pc.26029.
S. Amini Niaki, E. Haghighat, T. Campbell, A. Poursartip, and R. Vaziri, “Physics‐Informed Neural Network for Modelling the Thermochemical Curing Process of Composite‐Tool Systems During Manufacture,” Computer Methods in Applied Mechanics and Engineering 384 (2021): 113959, https://doi.org/10.1016/j.cma.2021.113959.
A. Michaloglou, I. Papadimitriou, I. Gialampoukidis, S. Vrochidis, and I. Kompatsiaris, “Physics‐Informed Neural Networks in Materials Modeling and Design: A Review,” Archives of Computational Methods in Engineering (2025), https://doi.org/10.1007/s11831‐025‐10448‐9.
B. Liu, Y. Wang, T. Rabczuk, T. Olofsson, and W. Lu, “Multi‐Scale Modeling in Thermal Conductivity of Polyurethane Incorporated with Phase Change Materials Using Physics‐Informed Neural Networks,” Renewable Energy 220 (2024): 119565, https://doi.org/10.1016/j.renene.2023.119565.

52473330 National Natural Science Foundation of China; 20230484280 Beijing Nova Program

Keywords: ceramic substrate; multiscale simulation; power electronics; thermal interface materials; thermal management materials

Date Created: 20260216 Latest Revision: 20260216

20260217

10.1002/advs.202524348

41698048

MEDLINE